Methods for adaptive trip point detection

ABSTRACT

Methods are described for providing an adaptive trip point detector circuit that receives an input signal at an input signal node and generates an output signal at an output signal node, the output signal changing from a first value to a second value when the input signal exceeds a trip point reference value. In particular, the trip point reference value is adjusted to compensate for variations in process or temperature.

REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No. 11/106,288, filed 14 Apr. 2005, now U.S. Pat. No. _,___,___, which is incorporated by reference herein in its entirety, and is related to U.S. patent application Ser. No. __/___,___, entitled “Apparatus for Adaptive Trip Point Detection,” which is filed concurrently herewith, and which is incorporated by reference herein in its entirety.

BACKGROUND

Most electronic circuits, such as integrated circuits, receive power from an externally-supplied power supply. For example, an electronic system may include a power supply (e.g., V₃₃) that supplies power to one or more integrated circuits included in the system. At system start-up, V₃₃ may start at an initial value (e.g., 0 volts), and then gradually increase to its full-scale value (e.g., 3.3 volts). Many integrated circuits, however, include chip configuration circuits or other circuits that require a minimum power supply voltage (e.g., 1.5 volts) for normal operation. If a power supply signal less than the minimum is applied to such configuration circuits, the chip may not operate properly. As a result, many integrated circuits use power-on reset (“POR”) circuitry to sense the voltage level of the power supply signal, and generate a control signal that indicates when V₃₃ exceeds the minimum power supply voltage.

To accomplish this task, POR circuits typically compare the power supply signal with a reference signal that has a voltage level equal to the minimum power supply voltage, and generate a control signal that indicates when V₃₃ is greater than the reference voltage. If the reference signal is an external signal (i.e., off-chip) that is always available, this task is quite straightforward. In most instances, however, an external reference signal is not available, but instead must be generated internally. Previously known POR circuits typically generate such reference signals by using properties of semiconductor devices, such as the threshold voltages of transistors and diodes.

For example, referring now to FIG. 1, a previously known POR circuit is described. POR circuit 10 includes trip detector circuit 12 and filtering circuit 14. Trip detector circuit 12 has an input coupled to V₃₃, and generates an output signal X_(HI) that may be used to indicate when V₃₃ is greater than an internally-generated trip-point reference signal V_(REF). Filtering circuit 14 smoothes and further processes signal X_(HI), and generates an output control signal POR_(OUT) that may be used to indicate when power supply signal V₃₃ is sufficiently high for normal circuit operation.

Referring now to FIG. 2, an exemplary previously known trip detector circuit 12 is described. Trip detector circuit 12 includes diode-connected p-channel transistor 16 having its source terminal coupled to power supply V₃₃, and its drain and gate terminals coupled together at node V_(x). Node V_(x), also is coupled to ground via resistor 20, and to the gate of n-channel transistor 18. N-channel transistor 18 has its drain coupled to output node X_(HI), which also is coupled to power supply V₃₃ via resistor 22. P-channel transistor 16 has a threshold voltage V_(TP) having a nominal magnitude of about 0.8V, and n-channel transistor 18 has a threshold voltage V_(TN) having a nominal value of about 0.8V. For simplicity, the symbol V_(TP) will be used to refer to the magnitude of a p-channel transistor.

Referring now to FIGS. 2 and 3, the operation of exemplary trip detector circuit 12 is described. In particular, FIG. 3 illustrates V₃₃, V_(x) and X_(HI) as a function of time. At t=0, V₃₃=0V, transistor 16 is OFF, and no current flows through resistor 20. As a result, V_(x)=0V, transistor 18 is OFF, no current flows through resistor 22, and X_(HI=V) ₃₃=0V. For 0≦t<T₁, V₃₃ increases, but remains below V_(TP). As a result, transistor 16 remains OFF, and V_(x)=0. At t=T₁, V₃₃ exceeds V_(x) by the threshold voltage V_(TP), and transistor 16 begins to conduct. If resistor 20 is very large, the drain current of transistor 16 is very small, and V_(x) remains one V_(TP) below V₃₃. For T₁≦t<T₂, the voltage on node V_(x) increases with increasing V₃₃, but remains below the threshold voltage V_(TN) of transistor 18. Accordingly, transistor 18 remains OFF, no current flows through resistor 22, and thus X_(HI)=V₃₃. At t=T₂, V_(x) is greater than V_(TN), and transistor 18 begins to conduct. If resistor 22 is large, the drain current of transistor 18 is small, and transistor 18 pulls X_(HI) to ground. Thus, X_(HI) changes from a positive non-zero voltage to 0V when V₃₃ exceeds trip-point reference signal V_(REF)=V_(TP)+V_(TN).

Threshold voltages V_(TP) and V_(TN), however, may vary significantly with variations in processing and temperature. For example, over normal process and temperature variations, threshold voltages V_(TP) and V_(TN) may have values between 0.6V to 1.2V. As a result, trip-point reference signal V_(REF) may vary between V_(REFL)=1.2V to V_(REFH)=2.4V. For some circuit applications, such a wide variation in V_(REF) may be unacceptable. For example, as described above, if a chip configuration circuit requires that V₃₃ be at least 1.5V, such a circuit may fail if threshold voltages V_(TP) and V_(TN) are low (e.g., V_(TN)=V_(TP)=0.6V, and thus V_(REF)=1.2V). Likewise, if threshold voltages V_(TP) and V_(TN) are both high (e.g., V_(TN)=V_(TP)=1.7V, and thus V_(REF)=3.4V), X_(HI) may never change state, and thus the POR circuit would fail.

In view of the foregoing, it would be desirable to provide methods and apparatus that reduce the sensitivity of trip point detection circuits to process and temperature variations.

It also would be desirable to provide methods and apparatus that increase the trip point reference V_(REF) of trip point detection circuits when transistor threshold voltages are lowered as a result of process or temperature conditions.

It additionally would be desirable to provide methods and apparatus that decrease the trip point reference V_(REF) of trip point detection circuits when transistor threshold voltages are raised as a result of process or temperature conditions.

SUMMARY

Methods in accordance with this invention provide adaptive trip point detection circuits that adjust the trip point reference signal value to compensate for variations in process or temperature, without requiring an externally-supplied reference signal. In a first exemplary embodiment, a controlled current source is coupled to an internal node of a trip point detection circuit, and the controlled current source conducts a current that varies based on process and temperature conditions. For nominal or slow processes or nominal or low temperature conditions, the trip-point reference signal value equals a sum of two threshold voltages. For fast processes or high temperature conditions, in contrast, the trip-point reference signal value is increased.

In a second exemplary embodiment, a controlled current source is coupled to the output node of a trip point detection circuit, and the controlled current source conducts a current that varies based on process and temperature conditions. For nominal or slow processes or nominal or low temperature conditions, the trip-point reference signal value equals a sum of two threshold voltages. For fast processes or high temperature conditions, in contrast, the trip-point reference signal value is increased.

In a third exemplary embodiment, a first controlled current source is coupled to an internal node of a trip point detection circuit, a second controlled current source is coupled to an output node of the trip point detection circuit, and the first and second controlled current sources conduct currents that vary based on process and temperature conditions. For nominal or slow processes or nominal or low temperature conditions, the trip-point reference signal value equals a sum of two threshold voltages. For fast processes or high temperature conditions, in contrast, the trip-point reference signal value is increased.

In a fourth exemplary embodiment a first transistor having a nominal threshold voltage and a second transistor having a high threshold voltage are coupled to an output node of a trip point detection circuit, and the first and second transistors are switched in or out of the trip point detector circuit based on process and temperature conditions. For nominal or slow processes or nominal or low temperature conditions, the first transistor is switched into the trip point detector circuit. For fast processes or high temperature conditions, in contrast, the second transistor is switched into the trip point detector circuit.

BRIEF DESCRIPTION OF THE DRAWINGS

The above-mentioned objects and features of the present invention can be more clearly understood from the following detailed description considered in conjunction with the following drawings, in which the same reference numerals denote the same elements throughout, and in which:

FIG. 1 is a diagram of a previously known power-on reset circuit;

FIG. 2 is diagram of a previously known trip detector circuit;

FIG. 3 is a diagram of signal response values of the circuit of FIG. 2;

FIG. 4 is a diagram of an exemplary trip-point detector circuit in accordance with this invention;

FIG. 5 is a diagram of signal response values of the circuit of FIG. 4;

FIG. 6 is a diagram of an exemplary implementation of the circuit of FIG. 4;

FIG. 7 is a diagram of an alternative exemplary trip-point detector circuit in accordance with this invention;

FIG. 8 is a diagram of signal response values of the circuit of FIG. 7;

FIG. 9 is a diagram of an exemplary implementation of the circuit of FIG. 7;

FIG. 10 is a diagram of an exemplary V_(BE) detector circuit of FIG. 9;

FIG. 11 is a diagram of another alternative exemplary trip-point detector circuit in accordance with this invention;

FIG. 12 is a diagram of signal response values of the circuit of FIG. 11;

FIG. 13 is a diagram of still another alternative exemplary trip-point detector circuit in accordance with this invention; and

FIG. 14 is a diagram of signal response values of the circuit of FIG. 13.

DETAILED DESCRIPTION

The present invention provides methods and apparatus that reduce the sensitivity of trip point detection circuits to process and temperature variations. In some embodiments, methods and apparatus in accordance with this invention increase the trip point reference V_(REF) when transistor threshold voltages are lowered as a result of process or temperature conditions. In other embodiments, methods and apparatus in accordance with this invention decrease the trip point reference V_(REF) when transistor threshold voltages are raised as a result of process or temperature conditions. As used herein, a semiconductor process is characterized as “nominal,” “slow” or “fast,” based on the value of transistor threshold voltages produced by the process. In particular, a process is characterized as nominal, slow or fast if the transistors produced by the process have nominal, high or low threshold voltages, respectively.

Persons of ordinary skill in the art will understand that because p-channel and n-channel transistors are produced by different process steps, the threshold voltages of p-channel and n-channel transistors may not necessarily track one another. Thus, wafers produced by a single process may have “slow” p-channel transistors and “fast” n-channel transistors. As a result, methods and apparatus in accordance with this invention may adjust the trip point reference V_(REF) based on detecting process-induced shifts in the threshold voltages of p-channel transistors only, n-channel transistors only, or both p- and n-channel transistors.

Referring now to FIG. 4, an exemplary trip point detector circuit in accordance with this invention is described. Trip point detector circuit 12 a includes the same circuit elements as trip point detector circuit 12 of FIG. 2, but also includes controlled current source 24 coupled between node V_(x) and ground. As described in more detail below, controlled current source 24 conducts a current I₁ that varies based on process and temperature conditions. The following table illustrates an exemplary output response of controlled current source 24 as a function of process and temperature conditions: TABLE 1 Process/Temperature I₁ slow process or low temperature 0 nominal process or nominal temperature 0 fast process or high temperature >0

That is, for slow or nominal processes, or low or nominal temperature, controlled current source 24 conducts no current. As a result, controlled current source 24 is effectively disconnected from node V_(x), and trip point detector circuit 12 a behaves like previously known trip point detector circuit 12 of FIG. 2. In contrast, for fast processes or high temperature, controlled current source 24 conducts current I₁>0, and effectively increases trip point reference signal V_(REF).

Referring now to FIGS. 4 and 5, the operation of trip detector circuit 12 a is described for fast processes or high temperature conditions that result in low threshold voltages (e.g., V_(TN)=0.6V or V_(TP)=0.6V). Persons of ordinary skill in the art will understand that threshold voltages V_(TN) and V_(TP) may not necessarily have equal values, and that methods and apparatus in accordance with this invention do not require that the two threshold voltages be equal. At t=0, V₃₃=0V, transistor 16 is OFF, and no current flows through resistor 20. As a result (assuming V_(x) cannot go below ground), V_(x)=0V, transistor 18 is OFF, no current flows through resistor 22, and X_(HI)=V₃₃=0V. For 0≦t<T₁′, V₃₃ increases, but remains below V_(TP). As a result, transistor 16 remains OFF, and V_(X)=0. At t=T_(I)′, V₃₃ exceeds V_(x) by the threshold voltage V_(TP), and transistor 16 begins to conduct. Because resistor 20 is large, transistor 16 tries to supply almost all of current I₁ required by controlled current source 24. As a result, V_(x) remains at ground.

For T₁′≦t<T₂′, V₃₃ increases, but V_(x) remains at ground as transistor 16 continues to try to supply current I₁. At t=T₂′, transistor 16 is fully saturated, which occurs at a V₃₃ value of: V ₃₃ =|V _(GS) |V _(TP) +ΔV _(a)  (1) where ΔV_(a) is given by: $\begin{matrix} {{\Delta\quad V_{a}} = \sqrt{\frac{2\quad I_{1}}{\beta_{16}}}} & (2) \\ {\beta_{16} = {\left( \frac{W}{L} \right)_{16}\frac{\mu\quad C_{OX}}{2}}} & (3) \end{matrix}$ where $\left( \frac{W}{L} \right)_{16}$ is the ratio of the width to length of transistor 16, μ is a constant and C_(ox) is a process parameter.

For T₂′≦t<T₃′, V_(x) continues to track V₃₃, but remains below the threshold voltage V_(TN) of transistor 18. Accordingly, transistor 18 remains OFF, and X_(HI)=V₃₃. At t=T₃′, when V_(x) equals V_(TN), transistor 18 turns ON, and pulls X_(HI) to ground. In this example, X_(HI) changes from a positive non-zero voltage to 0V when V₃₃ exceeds trip-point reference signal V_(REFa)=V_(TP)+V_(TN)+ΔV_(a). Thus, trip point detector circuit 12 a has a trip-point reference signal V_(REFa) that adapts to process and temperature conditions, as indicated in the following table: TABLE 2 Process/Temperature V_(REFa) slow process or low temperature V_(TP) + V_(TN) nominal process or nominal temperature V_(TP) + V_(TN) fast process or high temperature V_(TP) + V_(TN) + ΔV_(a) For nominal or slow processes or nominal or low temperature conditions (i.e., when threshold voltages V_(TN) and V_(TP) are nominal or high), trip-point reference signal V_(REFa) equals the sum of threshold voltages V_(TN) and V_(TP). However, for fast processes or high temperature conditions (i.e., when threshold voltages V_(TN) and V_(TP) are low), trip-point reference signal V_(REFa) equals the sum V_(TN)+V_(TP)+ΔV_(a).

Controlled current source 24 may be implemented using any circuit that has an output current that varies with process and temperature as shown in Table 1. Referring now to FIG. 6, an exemplary embodiment of such a circuit is described. In particular, trip point detector circuit 12 a ₁, includes native n-channel transistor 24 a having its drain terminal coupled to node V_(x), and its gate and source terminals coupled to ground. Native n-channel transistor 24 a, sometimes referred to as a depletion-mode transistor, has a threshold voltage V_(TZ) having a nominal value of approximately 0V. If native n-channel transistor 24 a is fabricated on the same die as n-channel transistor 18, the threshold voltage of both transistors often will track with temperature conditions and n-channel process conditions, as illustrated in the following table: TABLE 3 N-Process/Temperature V_(TN) V_(TZ) slow process or low temperature high high nominal process or nominal temperature nominal nominal fast process or high temperature low low

Thus, if V_(TZ) has a nominal value of 0V, for nominal or low temperatures, or slow or nominal n-processes, native n-channel transistor 24 a never turns ON because the transistor's gate-to-source voltage V_(GS)=0. Under such conditions, trip point detector circuit 12 a ₁ behaves like trip point detector circuit 12 of FIG. 2. However, for fast n-processes or high temperatures, V_(TZ) is less than 0V, and native n-channel transistor 24 a turns ON when V_(x) is above 0V. Thus, native n-channel transistor 24 a acts like a controlled current source whose current varies with n-process and temperature conditions, as in Table 1, above. As a result, trip point detector circuit 12 a, has a trip-point reference signal V_(REFa) that adapts to process and temperature conditions, as in Table 2, above. Persons of ordinary skill in the art will understand that trip point detector circuit 12 a ₁ alternatively may be configured to have a trip-point reference signal V_(REFa) that adapts to p-process and temperature conditions.

Referring now to FIG. 7, an alternative exemplary trip point detector circuit in accordance with this invention is described. Trip point detector circuit 12 b includes the same circuit elements as trip point detector circuit 12 of FIG. 2, but also includes controlled current source 26 coupled between V₃₃ and node X_(HI). As described in more detail below, controlled current source 26 conducts a current I₂ that varies based on process and temperature conditions. The following table illustrates an exemplary output response of controlled current source 26 as a function of process and temperature conditions: TABLE 4 Process/Temperature I₂ slow process or low temperature 0 nominal process or nominal temperature 0 fast process or high temperature >0

That is, for slow or nominal processes, or low or nominal temperature, controlled current source 26 conducts no current. As a result, controlled current source 26 is effectively disconnected from node X_(HI), and trip point detector circuit 12 b operates like previously known trip point detector circuit 12 of FIG. 2. In contrast, for fast processes or high temperature, controlled current source 26 conducts current I₂>0, and effectively increases trip point reference signal V_(REF).

Referring now to FIGS. 7 and 8, the operation of trip detector circuit 12 b is described for fast processes or high temperature conditions that result in low threshold voltages (e.g., V_(TN)=0.6V or V_(TP)=0.6V). At t=0, V₃₃=0V, transistor 16 is OFF, V_(x)=0V, transistor 18 is OFF, and X_(HI) equals V₃₃=0V. For 0≦t <T₁′, V₃₃ increases, but remains below V_(TP). As a result, transistor 16 remains OFF, V_(X)=0, and X_(HI)=V₃₃. At t=T_(I)′, V₃₃ exceeds V_(x) by the threshold voltage V_(TP), and transistor 16 therefore begins to conduct.

For T_(I)′≦t <T₂′, V_(X) remains one V_(TP) below V₃₃. Because V_(X) is less than V_(TN), transistor 18 remains OFF, and X_(HI)=V₃₃. At t=T₂′, V₃₃=V_(TP)+V_(TN), V_(x)=V_(TN), and transistor 18 begins to conduct. However, a higher gate-to-source voltage is required to turn ON transistor 18 and sink the current 12 from controlled current source 26. As a result, X_(HI)=V₃₃. At t=T₃″, transistor 18 is fully saturated, and pulls X_(HI) to ground. This occurs when V₃₃ has a value of: V ₃₃ =V _(TP) +V _(GS18) =V _(TP)+(V _(TN) +ΔV _(b))  (4) where ΔV_(b) is given by: $\begin{matrix} {{\Delta\quad V_{b}} = \sqrt{\frac{2\quad I_{2}}{\beta_{18}}}} & (5) \\ {\beta_{18} = {\left( \frac{W}{L} \right)_{18}\frac{\mu\quad C_{OX}}{2}}} & (6) \end{matrix}$ where $\left( \frac{W}{L} \right)_{18}$ is the ratio of the width to length of transistor 18, μ is a constant and C_(ox) is a process parameter. In this example, X_(HI) changes from a positive non-zero voltage to 0V when V₃₃ exceeds trip-point reference signal V_(REFb)=V_(TP)+V_(TN)+ΔV_(b).

Thus, trip point detector circuit 12 b has a trip-point reference signal V_(REFb) that adapts to process and temperature conditions, as indicated in the following table: TABLE 5 Process/Temperature V_(REFb) slow process or low temperature V_(TP) + V_(TN) nominal process or nominal temperature V_(TP) + V_(TN) fast process or high temperature V_(TP) + V_(TN) + ΔV_(b) For nominal or slow processes or nominal or low temperature conditions (i.e., when threshold voltages V_(TN) and V_(TP) are nominal or high), trip-point reference signal V_(REFb) equals the sum of threshold voltages V_(TN) and V_(TP). However, for fast processes or high temperature conditions (i.e., when threshold voltages V_(TN) and V_(TP) are low), trip-point reference signal V_(REFb) equals the sum V_(TN)+V_(TP)+ΔV_(b).

Controlled current source 26 may be implemented using any circuit that has an output response as shown in Table 4. Referring now to FIG. 9, an exemplary embodiment of such a circuit is described. Trip point detector circuit 12 b ₁ includes p-channel transistor 26 b having its drain terminal coupled to node X_(HI), its gate terminal coupled to signal X_(FAST), and its source terminal coupled to node V₃₃. As described in more detail below, V_(BE) detector circuit 28 provides signal X_(FAST) whose value depends on process and temperature conditions. In particular, for nominal or slow processes, or nominal or low temperatures, X_(FAST) is HIGH, and transistor 26 b is OFF. Under such conditions, trip point detector circuit 12 b ₁, behaves like trip point detector circuit 12 of FIG. 2. In contrast, for fast processes or high temperatures, X_(FAST) is LOW, and transistor 26 b injects current into node X_(HI). Thus, transistor 26 b acts like a controlled current source whose current varies with process and temperature conditions, as in Table 1, above. As a result, trip point detector circuit 12 b ₁ has a trip-point reference signal V_(REFb) that adapts to process and temperature conditions, as in Table 4, above.

Referring now to FIG. 10, an exemplary V_(BE) detector circuit is described for generating X_(FAST). In particular, V_(BE) detector circuit 28 includes PNP transistor 30 having its base and collector terminals coupled to ground, and its emitter terminal coupled to V₃₃ via current source 32. The emitter terminal of PNP transistor 30 is also coupled to the gate of n-channel transistor 34, which has its source coupled to ground, and its drain terminal (node X_(FAST)) coupled to V₃₃ via current source 36. Thus, the base-emitter voltage of PNP transistor 30 equals the gate-source voltage of n-channel transistor 34.

The base-emitter voltage V_(BE) of PNP transistor 30 and the threshold voltage V_(TN) of n-channel transistor 34 tend to shift in the same direction with variations in n-process and temperature. However, variations in V_(BE) typically are much less than variations in V_(TN), and V_(BE) typically remains very close to 0.7V. Thus, if V_(TN) has a nominal value of 0.8V, for nominal or slow n-processes and nominal or low temperatures, V_(BE) is less than V_(TN). In contrast, for fast n-processes or high temperatures, V_(BE) is greater than V_(TN). Thus, for nominal or slow n-processes and nominal or low temperatures, the V_(BE) of PNP transistor 30 is less than V_(TN), transistor 34 is OFF, and X_(FAST) is HIGH. In contrast, for fast n-processes or high temperatures, the V_(BE) of PNP transistor 30 is greater than V_(TN), transistor 34 is ON, and X_(FAST) is LOW. Persons of ordinary skill in the art will understand that if V_(TN) has a nominal value other than 0.8V, V_(BE) may be compared to a scaled version of V_(TN) to generate X_(FAST). Persons of ordinary skill in the art will understand that V_(BE) detector circuit 28 alternatively may be configured to provide a signal X_(FAST) that varies based on p-process and temperature conditions.

Referring now to FIG. 11, another exemplary trip point detector circuit in accordance with this invention is described. In this example, the techniques illustrated in exemplary trip detector circuits 12 a ₁, and 12 b ₁, are combined. In particular, trip detector circuit 12 c includes native n-channel transistor 24 coupled between node V_(x) and ground, and p-channel transistor 26 b coupled between V₃₃ and node X_(HI). FIG. 12 illustrates the response of trip detector circuit 12 c for fast processes or high temperature conditions that result in low threshold voltages (e.g., V_(TN)=0.6V or V_(TP)=0.6V). Using an analysis similar to that described above, persons of ordinary skill in the art will understand that trip point detector circuit 12 c has a trip-point reference signal V_(REFc) that adapts to process and temperature conditions, as indicated in the following table: TABLE 6 Process/Temperature V_(REFc) slow process or low temperature V_(TP) + V_(TN) nominal process or nominal temperature V_(TP) + V_(TN) fast process or high temperature V_(TP) + V_(TN) + ΔV_(a) + ΔV_(b) where ΔV_(a)+ΔV_(b) have values as specified in equations (2) and (3), and (5) and (6), respectively.

Referring now to FIG. 13, another exemplary trip point detector circuit in accordance with this invention is described. In particular, trip point detector circuit 12 d includes n-channel transistors 38 and 40 having drain terminals coupled to node X_(HI), and source terminals coupled to the drain terminals of transistors 18 and 18F, respectively. In addition, transistor 38 has a gate terminal coupled to signal X_(FAST), and transistor 40 has a gate terminal coupled to signal FAST (i.e., the logical inverse of X_(FAST)). Transistor 18F is similar to transistor 18, but has a higher nominal threshold voltage V_(TNH) than the threshold voltage V_(TN) of transistor 18. For example, if V_(TN) has a nominal threshold voltage of 0.8V, V_(THN) may have a nominal value of 1.0V. The difference in threshold values may be achieved, for example, by adjusting the dimensions of transistor 18F relative to the dimensions of transistor 18, or by adjusting the processing steps that affect the threshold voltages of the two transistors.

Transistors 38 and 40 are sized to operate as switches that alternately switch transistors 18 or 18F in or out of the circuit based on process and temperature conditions. In particular, for nominal or slow processes, or nominal or low temperatures, X_(FAST) is HIGH, FAST is LOW, the drain of transistor 18 is coupled to node X_(HI), and transistor 18F is effectively disconnected from the rest of the circuit. Under such conditions, trip point detector circuit 12 d behaves like trip point detector circuit 12 of FIG. 2. In contrast, for fast processes or high temperatures, X_(FAST) is LOW, FAST is HIGH, the drain of transistor 18F is coupled to node X_(HI), and transistor 18 is effectively disconnected from the rest of the circuit. Thus, for fast processes or high temperatures, trip point detector circuit 12 d swaps nominal threshold transistor 18 with high threshold transistor 18F.

If transistors 18 and 18F are fabricated on the same die, the threshold voltage of both transistors often will track with process and temperature conditions, an example of which is illustrated in the following table: TABLE 7 N-Process/Temperature V_(TN) V_(TNH) slow process or low temperature 1.0 1.2 nominal process or nominal temperature 0.8 1.0 fast process or high temperature 0.6 0.8

Referring now to FIGS. 13 and 14, the operation of trip point detector circuit 12 d is described for fast processes or high temperature conditions that result in low threshold voltages. In this example, V_(TN)=V_(TP)=0.6V, V_(TNH)=0.8V, X_(FAST) is LOW, and FAST is HIGH. As a result, transistor 18 is effectively switched out of the circuit, and transistor 18 F is effectively switched into the circuit. At t=0, V₃₃=0V, transistor 16 is OFF, V_(x)=0V, transistor 18F is OFF, and X_(HI) equals V₃₃=0V. For 0≦t<T₁′, V₃₃ increases, but remains below V_(TP). As a result, transistor 16 remains OFF, V_(X)=0, and X_(HI)=V₃₃. At t=T₁′, V₃₃ exceeds V_(x) by the threshold voltage V_(TP), and transistor 16 therefore begins to conduct. For T₁′≦t<T₅, V_(X) remains one V_(TP) below V₃₃. Because V_(X) is less than V_(TNH), transistor 18F remains OFF, and X_(HI)=V₃₃. At t=T₅, V₃₃=V_(TP)+V_(TN)H, V_(x)=V_(TN)H, and transistor 18F turns ON and pulls X_(HI) to ground. In this example, X_(HI) changes from a positive non-zero voltage to 0V when V₃₃ exceeds trip-point reference signal V_(REFd)=V_(TP)+V_(TNH).

The exemplary circuits described above illustrate techniques used to increase the trip point reference V_(REF) when transistor threshold voltages are lowered as a result of process or temperature conditions. Persons of ordinary skill in the art will understand that methods and apparatus in accordance with this invention also may be used to decrease the trip point reference V_(REF) when transistor threshold voltages are raised as a result of process or temperature conditions. For example, in trip point detector circuit 12 _(b1) illustrated in FIG. 9, the gate of p-channel transistor 26 _(b) may be coupled to a control signal SLOW that is LOW for nominal or fast processes, or nominal or high temperatures, and HIGH for slow processes or low temperature conditions. In that regard, current I₂ would be injected into the drain of transistor 18 except if process or temperature conditions tended to increase threshold voltages V_(TP) and V_(TN). Under such circumstance, I₂ would turn OFF, which would decrease the trip point reference V_(REF).

Alternatively, in trip point detector circuit 12 d illustrated in FIG. 13, the gate terminals of transistors 38 and 40 may be coupled to X_(SLOW) (i.e., the logical inverse of SLOW) and SLOW, respectively, and transistor 18F may be fabricated to have a lower nominal threshold voltage V_(TNL) than the threshold voltage V_(TN) of transistor 18. Thus, for nominal or fast processes, or nominal or high temperatures, X_(SLOW) is HIGH, SLOW is LOW, the drain of transistor 18 is coupled to node X_(HI), and transistor 18F is effectively disconnected from the rest of the circuit. In contrast, for slow processes or low temperatures, X_(SLOW) is LOW, SLOW is HIGH, the drain of transistor 18F is coupled to node X_(HI), and transistor 18 is effectively disconnected from the rest of the circuit. Thus, for slow processes or low temperatures, trip point detector circuit 12 d swaps nominal threshold transistor 18 with high threshold transistor 18F, which would decrease the trip point reference V_(REF).

The foregoing merely illustrates the principles of this invention, and various modifications can be made by persons of ordinary skill in the art without departing from the scope and spirit of this invention. 

1. A method for adapting a trip point reference value of a trip point detector circuit that receives an input signal at an input signal node and generates an output signal at an output signal node, the output signal changing from a first value to a second value when the input signal exceeds the trip point reference value, the method comprising: providing a circuit element adapted to adjust the trip point reference value to compensate for variations in process or temperature, wherein the circuit element is effectively disconnected from the trip point detector circuit except under predetermined process or temperature conditions.
 2. The method of claim 1, wherein the circuit element is adapted to increase the trip point reference value.
 3. The method of claim 1, wherein the circuit element is adapted to decrease the trip point reference value.
 4. The method of claim 1, wherein the circuit element is adapted to adjust the trip point reference value based on a value of a transistor threshold voltage.
 5. The method of claim 1, wherein the circuit element comprises a controlled current source.
 6. The method of claim 5, wherein the controlled current source conducts a current that varies based on process and temperature conditions.
 7. The method of claim 5, wherein the controlled current source comprises a transistor.
 8. The method of claim 5, wherein the controlled current source comprises a depletion-mode transistor.
 9. A method for adapting a trip point reference value of a trip point detector circuit that receives an input signal at an input signal node and generates an output signal at an output signal node, the output signal changing from a first value to a second value when the input signal exceeds the trip point reference value, the method comprising: providing a first transistor coupled between the input signal node and an internal node; providing a second transistor coupled between the internal node and the output signal node; and providing a controlled current source coupled to the internal signal node, the controlled current source adapted to adjust the trip point reference value to compensate for variations in process or temperature, wherein the controlled current source is effectively disconnected from the trip point detector circuit except under predetermined process or temperature conditions.
 10. The method of claim 9, wherein the controlled current source is adapted to increase the trip point reference value.
 11. The method of claim 9, wherein the controlled current source is adapted to decrease the trip point reference value.
 12. The method of claim 9, wherein the controlled current source is adapted to adjust the trip point reference value based on a value of a transistor threshold voltage.
 13. The method of claim 9, wherein the controlled current source comprises a transistor.
 14. The method of claim 9, wherein the controlled current source comprises a depletion-mode transistor.
 15. A method for adapting a trip point reference value of a trip point detector circuit that receives an input signal at an input signal node and generates an output signal at an output signal node, the output signal changing from a first value to a second value when the input signal exceeds the trip point reference value, the method comprising: providing a first transistor coupled between the input signal node and an internal node; providing a second transistor coupled between the internal node and the output signal node; and providing a controlled current source coupled to the output signal node, the controlled current source adapted to adjust the trip point reference value to compensate for variations in process or temperature, wherein the controlled current source is effectively disconnected from the trip point detector circuit except under predetermined process or temperature conditions.
 16. The method of claim 15, wherein the controlled current source is adapted to increase the trip point reference value.
 17. The method of claim 15, wherein the controlled current source is adapted to decrease the trip point reference value.
 18. The method of claim 15, wherein the controlled current source is adapted to adjust the trip point reference value based on a value of a transistor threshold voltage.
 19. The method of claim 15, wherein the controlled current source comprises a transistor.
 20. A method for adapting a trip point reference value of a trip point detector circuit that receives an input signal at an input signal node and generates an output signal at an output signal node, the output signal changing from a first value to a second value when the input signal exceeds the trip point reference value, the method comprising: providing a control circuit that generates a control signal that has a first value under first predetermined process or temperature conditions, and has a second value under second predetermined process or temperature conditions; and providing a circuit element adapted to adjust the trip point reference value to compensate for variations in process or temperature based on the control signal value, wherein the circuit element is effectively disconnected from the trip point detector circuit if the control signal has the second value.
 21. The method of claim 20, wherein the control circuit comprises a PNP transistor.
 22. The method of claim 20, wherein the control circuit comprises a V_(BE) detector.
 23. The method of claim 20, wherein the control circuit generates the control signal based on a transistor base-emitter voltage.
 24. The method of claim 20, wherein the control circuit comprises a transistor that generates the control signal based a transistor base-emitter voltage.
 25. The method of claim 20, wherein the control circuit generates the control signal based on n-process and temperature conditions.
 26. The method of claim 20, wherein the control circuit generates the control signal based on p-process and temperature conditions.
 27. A method for adapting a trip point reference value of a trip point detector circuit that receives an input signal at an input signal node and generates an output signal at an output signal node, the output signal changing from a first value to a second value when the input signal exceeds the trip point reference value, the method comprising: providing first and second circuit elements adapted to adjust the trip point reference value to compensate for variations in process or temperature, wherein the first and second circuit elements conduct substantially no current except under predetermined process or temperature conditions.
 28. The method of claim 27, wherein the first and second circuit elements operate to increase the trip point reference value.
 29. The method of claim 27, wherein the first and second circuit elements operate to decrease the trip point reference value.
 30. The method of claim 27, wherein the first and second circuit elements adjust the trip point reference value based on values of transistor threshold voltages.
 31. The method of claim 27, wherein the first and second circuit elements each comprise a controlled current source.
 32. The method of claim 31, wherein each controlled current source conducts a current that varies based on process and temperature conditions.
 33. The method of claim 31, wherein each controlled current source comprises a transistor.
 34. The method of claim 31, wherein the first circuit element comprises a depletion-mode transistor.
 35. A method for adapting a trip point reference value of a trip point detector circuit that receives an input signal at an input signal node and generates an output signal at an output signal node, the output signal changing from a first value to a second value when the input signal exceeds the trip point reference value, the method comprising: a first transistor having a first threshold voltage; a second transistor having a second threshold voltage; and a means for switching between the first and second transistors to adjust the trip point reference value to compensate for variations in process or temperature.
 36. The method of claim 35, wherein the first threshold voltage is lower than the second threshold voltage.
 37. The method of claim 35, wherein the means for switching comprises third and fourth transistors.
 38. The method of claim 35, wherein the means for switching effectively disconnects the first transistor or the second transistor from the trip point detector circuit based on process and temperature conditions.
 39. The method of claim 35, wherein a dimension of the second transistor is set relative to a dimension of the first transistor so that the second threshold voltage is higher than the first threshold voltage. 